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Wednesday, October 14, 2020 | History

4 edition of ITherm 2000 found in the catalog.

ITherm 2000

the Seventh Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, presented at Las Vegas, Nevada, USA, May 23-26, 2000

by InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (7th 2000 Las Vegas, Nev.)

  • 82 Want to read
  • 38 Currently reading

Published by IEEE in Piscataway, New Jersey .
Written in English

    Subjects:
  • Electronic apparatus and appliances -- Thermal properties -- Congresses.,
  • Heat sinks (Electronics) -- Congresses.,
  • Ball grid array technology -- Congresses.

  • Edition Notes

    Other titlesITherm 2000., Thermal and thermomechanical phenomena in electronic systems., Seventh Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems.
    Statementsponsored by the Components, Packaging and Manufacturing Technology Society of the Institute of Electrical and Electronics Engineers (CPMT/IEEE) ; edited by Gary B. Kromann, J. Richard Culham, Koneru Ramakrishna.
    GenreCongresses.
    ContributionsCulham, J. Richard., Kromann, Gary B., Ramakrishna, Koneru., Components, Packaging & Manufacturing Technology Society.
    The Physical Object
    Pagination2 v. :
    ID Numbers
    Open LibraryOL18141164M
    ISBN 100780359127, 0780359135, 0780359143

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ITherm 2000 by InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (7th 2000 Las Vegas, Nev.) Download PDF EPUB FB2

ITHERM ACHIEVEMENT AWARD RECIPIENT Dr. Wataru Nakayama. Wataru Nakayama has developed his professional career as a heat transfer expert and educator through his over-thirty-years-long associations with the industry and the universities. Wataru received his Doctor of Engineering degree from the Tokyo Institute of Technology in Get this from a library.

ITherm the Seventh Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, presented at Las Vegas, Nevada, USA, May[J Richard Culham; Gary B Kromann; Koneru Ramakrishna; Components, Packaging & Manufacturing Technology Society.;].

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