4 edition of ITherm 2000 found in the catalog.
|Other titles||ITherm 2000., Thermal and thermomechanical phenomena in electronic systems., Seventh Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems.|
|Statement||sponsored by the Components, Packaging and Manufacturing Technology Society of the Institute of Electrical and Electronics Engineers (CPMT/IEEE) ; edited by Gary B. Kromann, J. Richard Culham, Koneru Ramakrishna.|
|Contributions||Culham, J. Richard., Kromann, Gary B., Ramakrishna, Koneru., Components, Packaging & Manufacturing Technology Society.|
|The Physical Object|
|Pagination||2 v. :|
|ISBN 10||0780359127, 0780359135, 0780359143|
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ITHERM ACHIEVEMENT AWARD RECIPIENT Dr. Wataru Nakayama. Wataru Nakayama has developed his professional career as a heat transfer expert and educator through his over-thirty-years-long associations with the industry and the universities. Wataru received his Doctor of Engineering degree from the Tokyo Institute of Technology in Get this from a library.
ITherm the Seventh Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, presented at Las Vegas, Nevada, USA, May[J Richard Culham; Gary B Kromann; Koneru Ramakrishna; Components, Packaging & Manufacturing Technology Society.;].
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He is a Fellow of ASME. He was the General Chair of the IThermProgram Chair, IThermand Program Co-Chair, ITherm He organized several sessions on thermal and thermo-mechanical aspects of electronic packages at ITherm'98, InterPack'95 and '97, and at ASME IMECE. iTherm Technologies is a state-of-the-art manufacturer of industrial power supplies, featuring our patented HIG’99 technology and induction soldering services.
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He was the Program Co-Chair for IThermProgram Chair for IThermand elected General Chair of the ITherm He has also organized several sessions on thermal and thermo-mechanical. In: Proceedings of the Seventh Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm ), vol.
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